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Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals

The success of strain engineering has made a step further for the enhancement of material properties and the introduction of new physics, especially with the discovery of the critical roles of strain in the heterogeneous interface between two dissimilar materials (for example, FeSe/SrTiO(3)). On the...

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Autores principales: Wang, Yiping, Sun, Xin, Chen, Zhizhong, Cai, Zhonghou, Zhou, Hua, Lu, Toh-Ming, Shi, Jian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5969812/
https://www.ncbi.nlm.nih.gov/pubmed/29806024
http://dx.doi.org/10.1126/sciadv.aar3679
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author Wang, Yiping
Sun, Xin
Chen, Zhizhong
Cai, Zhonghou
Zhou, Hua
Lu, Toh-Ming
Shi, Jian
author_facet Wang, Yiping
Sun, Xin
Chen, Zhizhong
Cai, Zhonghou
Zhou, Hua
Lu, Toh-Ming
Shi, Jian
author_sort Wang, Yiping
collection PubMed
description The success of strain engineering has made a step further for the enhancement of material properties and the introduction of new physics, especially with the discovery of the critical roles of strain in the heterogeneous interface between two dissimilar materials (for example, FeSe/SrTiO(3)). On the other hand, the strain manipulation has been limited to chemical epitaxy and nanocomposites that, to a large extent, limit the possible material systems that can be explored. By defect engineering, we obtained, for the first time, dense three-dimensional strongly correlated VO(2±δ) epitaxial nanoforest arrays that can be used as a novel “substrate” for dynamic strain engineering, due to its metal-insulator transition. The highly dense nanoforest is promising for the possible realization of bulk strain similar to the effect of nanocomposites. By growing single-crystalline halide perovskite CsPbBr(3), a mechanically soft and emerging semiconducting material, onto the VO(2±δ), a heterogeneous interface is created that can entail a ~1% strain transfer upon the metal-insulator transition of VO(2±δ). This strain is large enough to trigger a structural phase transition featured by PbX(6) octahedral tilting along with a modification of the photoluminescence energy landscape in halide perovskite. Our findings suggest a promising strategy of dynamic strain engineering in a heterogeneous interface carrying soft and strain-sensitive semiconductors that can happen at a larger volumetric value surpassing the conventional critical thickness limit.
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spelling pubmed-59698122018-05-27 Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals Wang, Yiping Sun, Xin Chen, Zhizhong Cai, Zhonghou Zhou, Hua Lu, Toh-Ming Shi, Jian Sci Adv Research Articles The success of strain engineering has made a step further for the enhancement of material properties and the introduction of new physics, especially with the discovery of the critical roles of strain in the heterogeneous interface between two dissimilar materials (for example, FeSe/SrTiO(3)). On the other hand, the strain manipulation has been limited to chemical epitaxy and nanocomposites that, to a large extent, limit the possible material systems that can be explored. By defect engineering, we obtained, for the first time, dense three-dimensional strongly correlated VO(2±δ) epitaxial nanoforest arrays that can be used as a novel “substrate” for dynamic strain engineering, due to its metal-insulator transition. The highly dense nanoforest is promising for the possible realization of bulk strain similar to the effect of nanocomposites. By growing single-crystalline halide perovskite CsPbBr(3), a mechanically soft and emerging semiconducting material, onto the VO(2±δ), a heterogeneous interface is created that can entail a ~1% strain transfer upon the metal-insulator transition of VO(2±δ). This strain is large enough to trigger a structural phase transition featured by PbX(6) octahedral tilting along with a modification of the photoluminescence energy landscape in halide perovskite. Our findings suggest a promising strategy of dynamic strain engineering in a heterogeneous interface carrying soft and strain-sensitive semiconductors that can happen at a larger volumetric value surpassing the conventional critical thickness limit. American Association for the Advancement of Science 2018-05-25 /pmc/articles/PMC5969812/ /pubmed/29806024 http://dx.doi.org/10.1126/sciadv.aar3679 Text en Copyright © 2018 The Authors, some rights reserved; exclusive licensee American Association for the Advancement of Science. No claim to original U.S. Government Works. Distributed under a Creative Commons Attribution NonCommercial License 4.0 (CC BY-NC). http://creativecommons.org/licenses/by-nc/4.0/ This is an open-access article distributed under the terms of the Creative Commons Attribution-NonCommercial license (http://creativecommons.org/licenses/by-nc/4.0/) , which permits use, distribution, and reproduction in any medium, so long as the resultant use is not for commercial advantage and provided the original work is properly cited.
spellingShingle Research Articles
Wang, Yiping
Sun, Xin
Chen, Zhizhong
Cai, Zhonghou
Zhou, Hua
Lu, Toh-Ming
Shi, Jian
Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title_full Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title_fullStr Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title_full_unstemmed Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title_short Defect-engineered epitaxial VO(2±δ) in strain engineering of heterogeneous soft crystals
title_sort defect-engineered epitaxial vo(2±δ) in strain engineering of heterogeneous soft crystals
topic Research Articles
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5969812/
https://www.ncbi.nlm.nih.gov/pubmed/29806024
http://dx.doi.org/10.1126/sciadv.aar3679
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