Cargando…

Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S

Cu-Sn-S family of compounds have been considered as very competitive thermoelectric candidates in recent years due to their abundance and eco-friendliness. The first-principles calculation reveals that the density of states (DOS) increases in the vicinity of the Fermi level (E(f)) upon an incorporat...

Descripción completa

Detalles Bibliográficos
Autores principales: Cui, Jiaolin, He, Tongtong, Han, Zhongkang, Liu, Xianglian, Du, Zhengliang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5974318/
https://www.ncbi.nlm.nih.gov/pubmed/29844408
http://dx.doi.org/10.1038/s41598-018-26362-z
_version_ 1783326793779904512
author Cui, Jiaolin
He, Tongtong
Han, Zhongkang
Liu, Xianglian
Du, Zhengliang
author_facet Cui, Jiaolin
He, Tongtong
Han, Zhongkang
Liu, Xianglian
Du, Zhengliang
author_sort Cui, Jiaolin
collection PubMed
description Cu-Sn-S family of compounds have been considered as very competitive thermoelectric candidates in recent years due to their abundance and eco-friendliness. The first-principles calculation reveals that the density of states (DOS) increases in the vicinity of the Fermi level (E(f)) upon an incorporation of Se in the Cu(4)Sn(7.5)S(16−x)Se(x) (x = 0–2.0) system, which indicates the occurrence of resonant states. Besides, the formation of Cu(Sn)-Se network upon the occupation of Se in S site reduces the Debye temperature from 395 K for Cu(4)Sn(7)S(16) (x = 0) to 180.8 K for Cu(4)Sn(7.5)S(16−x)Se(x) (x = 1.0). Although the point defects mainly impact the phonon scattering, an electron-phonon interaction also bears significance in the increase in phonon scattering and the further reducion of lattice thermal conductivity at high temperatures. As a consequence, the resultant TE figure of merit (ZT) reaches 0.5 at 873 K, which is 25% higher compared to 0.4 for Cu(4)Sn(7.5)S(16).
format Online
Article
Text
id pubmed-5974318
institution National Center for Biotechnology Information
language English
publishDate 2018
publisher Nature Publishing Group UK
record_format MEDLINE/PubMed
spelling pubmed-59743182018-05-31 Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S Cui, Jiaolin He, Tongtong Han, Zhongkang Liu, Xianglian Du, Zhengliang Sci Rep Article Cu-Sn-S family of compounds have been considered as very competitive thermoelectric candidates in recent years due to their abundance and eco-friendliness. The first-principles calculation reveals that the density of states (DOS) increases in the vicinity of the Fermi level (E(f)) upon an incorporation of Se in the Cu(4)Sn(7.5)S(16−x)Se(x) (x = 0–2.0) system, which indicates the occurrence of resonant states. Besides, the formation of Cu(Sn)-Se network upon the occupation of Se in S site reduces the Debye temperature from 395 K for Cu(4)Sn(7)S(16) (x = 0) to 180.8 K for Cu(4)Sn(7.5)S(16−x)Se(x) (x = 1.0). Although the point defects mainly impact the phonon scattering, an electron-phonon interaction also bears significance in the increase in phonon scattering and the further reducion of lattice thermal conductivity at high temperatures. As a consequence, the resultant TE figure of merit (ZT) reaches 0.5 at 873 K, which is 25% higher compared to 0.4 for Cu(4)Sn(7.5)S(16). Nature Publishing Group UK 2018-05-29 /pmc/articles/PMC5974318/ /pubmed/29844408 http://dx.doi.org/10.1038/s41598-018-26362-z Text en © The Author(s) 2018 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Article
Cui, Jiaolin
He, Tongtong
Han, Zhongkang
Liu, Xianglian
Du, Zhengliang
Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title_full Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title_fullStr Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title_full_unstemmed Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title_short Improved thermoelectric performance of solid solution Cu(4)Sn(7.5)S(16) through isoelectronic substitution of Se for S
title_sort improved thermoelectric performance of solid solution cu(4)sn(7.5)s(16) through isoelectronic substitution of se for s
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5974318/
https://www.ncbi.nlm.nih.gov/pubmed/29844408
http://dx.doi.org/10.1038/s41598-018-26362-z
work_keys_str_mv AT cuijiaolin improvedthermoelectricperformanceofsolidsolutioncu4sn75s16throughisoelectronicsubstitutionofsefors
AT hetongtong improvedthermoelectricperformanceofsolidsolutioncu4sn75s16throughisoelectronicsubstitutionofsefors
AT hanzhongkang improvedthermoelectricperformanceofsolidsolutioncu4sn75s16throughisoelectronicsubstitutionofsefors
AT liuxianglian improvedthermoelectricperformanceofsolidsolutioncu4sn75s16throughisoelectronicsubstitutionofsefors
AT duzhengliang improvedthermoelectricperformanceofsolidsolutioncu4sn75s16throughisoelectronicsubstitutionofsefors