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Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC)
Single grit scratching is a basic form of material removal for many processes, such as grinding single point diamond turning and coating bonding performance tests. It has been widely used in the study of micro-scale and nano-scale material removal mechanisms. In this study, single grit linearly load...
Autores principales: | , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5978053/ https://www.ncbi.nlm.nih.gov/pubmed/29701652 http://dx.doi.org/10.3390/ma11050676 |
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author | Zhang, Libin Zhang, Tao Guo, Bicheng Yan, Lan Jiang, Feng |
author_facet | Zhang, Libin Zhang, Tao Guo, Bicheng Yan, Lan Jiang, Feng |
author_sort | Zhang, Libin |
collection | PubMed |
description | Single grit scratching is a basic form of material removal for many processes, such as grinding single point diamond turning and coating bonding performance tests. It has been widely used in the study of micro-scale and nano-scale material removal mechanisms. In this study, single grit linearly loading scratching tests were carried out on a scratching tester. A Rockwell indenter made of natural diamond was selected as the tool used, and the material of the workpiece was oxygen-free copper. Scratch topography was measured using a super-depth microscope to analyze the material deformation of the scratching process. A single grit scratching simulation has been developed by AdvantEdge™ to comprehensively study the material deformation of scratching processes. A material constitutive model and friction model were acquired using a quasi-static uniaxial compression experiment and a reciprocating friction test, respectively. These two models were used as the input models in the finite simulations. The simulated scratching forces aligned well with the experimental scratching forces, which verified the precision of the simulation model. Since only the scratching force could be obtained in the scratching experiment, the plastic strain, material flow, and residual stress of the scratching were further analyzed using simulations. The results showed that the plastic strain of the workpiece increased with the increase in scratching depth, and further analysis showed that the workpiece surface was distributed with residual compressive stress and the sub-surface was distributed with residual tensile stress in single grit scratching. |
format | Online Article Text |
id | pubmed-5978053 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-59780532018-05-31 Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) Zhang, Libin Zhang, Tao Guo, Bicheng Yan, Lan Jiang, Feng Materials (Basel) Article Single grit scratching is a basic form of material removal for many processes, such as grinding single point diamond turning and coating bonding performance tests. It has been widely used in the study of micro-scale and nano-scale material removal mechanisms. In this study, single grit linearly loading scratching tests were carried out on a scratching tester. A Rockwell indenter made of natural diamond was selected as the tool used, and the material of the workpiece was oxygen-free copper. Scratch topography was measured using a super-depth microscope to analyze the material deformation of the scratching process. A single grit scratching simulation has been developed by AdvantEdge™ to comprehensively study the material deformation of scratching processes. A material constitutive model and friction model were acquired using a quasi-static uniaxial compression experiment and a reciprocating friction test, respectively. These two models were used as the input models in the finite simulations. The simulated scratching forces aligned well with the experimental scratching forces, which verified the precision of the simulation model. Since only the scratching force could be obtained in the scratching experiment, the plastic strain, material flow, and residual stress of the scratching were further analyzed using simulations. The results showed that the plastic strain of the workpiece increased with the increase in scratching depth, and further analysis showed that the workpiece surface was distributed with residual compressive stress and the sub-surface was distributed with residual tensile stress in single grit scratching. MDPI 2018-04-26 /pmc/articles/PMC5978053/ /pubmed/29701652 http://dx.doi.org/10.3390/ma11050676 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Zhang, Libin Zhang, Tao Guo, Bicheng Yan, Lan Jiang, Feng Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title | Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title_full | Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title_fullStr | Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title_full_unstemmed | Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title_short | Research on the Single Grit Scratching Process of Oxygen-Free Copper (OFC) |
title_sort | research on the single grit scratching process of oxygen-free copper (ofc) |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5978053/ https://www.ncbi.nlm.nih.gov/pubmed/29701652 http://dx.doi.org/10.3390/ma11050676 |
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