Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †

We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-parallel Analo...

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Autores principales: Nose, Atsushi, Yamazaki, Tomohiro, Katayama, Hironobu, Uehara, Shuji, Kobayashi, Masatsugu, Shida, Sayaka, Odahara, Masaki, Takamiya, Kenichi, Matsumoto, Shizunori, Miyashita, Leo, Watanabe, Yoshihiro, Izawa, Takashi, Muramatsu, Yoshinori, Nitta, Yoshikazu, Ishikawa, Masatoshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5982237/
https://www.ncbi.nlm.nih.gov/pubmed/29695100
http://dx.doi.org/10.3390/s18051313
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author Nose, Atsushi
Yamazaki, Tomohiro
Katayama, Hironobu
Uehara, Shuji
Kobayashi, Masatsugu
Shida, Sayaka
Odahara, Masaki
Takamiya, Kenichi
Matsumoto, Shizunori
Miyashita, Leo
Watanabe, Yoshihiro
Izawa, Takashi
Muramatsu, Yoshinori
Nitta, Yoshikazu
Ishikawa, Masatoshi
author_facet Nose, Atsushi
Yamazaki, Tomohiro
Katayama, Hironobu
Uehara, Shuji
Kobayashi, Masatsugu
Shida, Sayaka
Odahara, Masaki
Takamiya, Kenichi
Matsumoto, Shizunori
Miyashita, Leo
Watanabe, Yoshihiro
Izawa, Takashi
Muramatsu, Yoshinori
Nitta, Yoshikazu
Ishikawa, Masatoshi
author_sort Nose, Atsushi
collection PubMed
description We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-parallel Analog-to-Digital Converters (ADCs) and 140 Giga Operation per Second (GOPS) programmable Single Instruction Multiple Data (SIMD) column-parallel PEs for new sensing applications. The 3D-stacked structure and column parallel processing architecture achieve high sensitivity, high resolution, and high-accuracy object positioning.
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spelling pubmed-59822372018-06-05 Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs † Nose, Atsushi Yamazaki, Tomohiro Katayama, Hironobu Uehara, Shuji Kobayashi, Masatsugu Shida, Sayaka Odahara, Masaki Takamiya, Kenichi Matsumoto, Shizunori Miyashita, Leo Watanabe, Yoshihiro Izawa, Takashi Muramatsu, Yoshinori Nitta, Yoshikazu Ishikawa, Masatoshi Sensors (Basel) Article We have developed a high-speed vision chip using 3D stacking technology to address the increasing demand for high-speed vision chips in diverse applications. The chip comprises a 1/3.2-inch, 1.27 Mpixel, 500 fps (0.31 Mpixel, 1000 fps, 2 × 2 binning) vision chip with 3D-stacked column-parallel Analog-to-Digital Converters (ADCs) and 140 Giga Operation per Second (GOPS) programmable Single Instruction Multiple Data (SIMD) column-parallel PEs for new sensing applications. The 3D-stacked structure and column parallel processing architecture achieve high sensitivity, high resolution, and high-accuracy object positioning. MDPI 2018-04-24 /pmc/articles/PMC5982237/ /pubmed/29695100 http://dx.doi.org/10.3390/s18051313 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Nose, Atsushi
Yamazaki, Tomohiro
Katayama, Hironobu
Uehara, Shuji
Kobayashi, Masatsugu
Shida, Sayaka
Odahara, Masaki
Takamiya, Kenichi
Matsumoto, Shizunori
Miyashita, Leo
Watanabe, Yoshihiro
Izawa, Takashi
Muramatsu, Yoshinori
Nitta, Yoshikazu
Ishikawa, Masatoshi
Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title_full Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title_fullStr Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title_full_unstemmed Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title_short Design and Performance of a 1 ms High-Speed Vision Chip with 3D-Stacked 140 GOPS Column-Parallel PEs †
title_sort design and performance of a 1 ms high-speed vision chip with 3d-stacked 140 gops column-parallel pes †
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5982237/
https://www.ncbi.nlm.nih.gov/pubmed/29695100
http://dx.doi.org/10.3390/s18051313
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