Thermal conductivity in Bi(0.5)Sb(1.5)Te(3+x) and the role of dense dislocation arrays at grain boundaries

Several prominent mechanisms for reduction in thermal conductivity have been shown in recent years to improve the figure of merit for thermoelectric materials. Such a mechanism is a hierarchical all-length-scale architecturing that recognizes the role of all microstructure elements, from atomic to n...

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Detalles Bibliográficos
Autores principales: Deng, Rigui, Su, Xianli, Zheng, Zheng, Liu, Wei, Yan, Yonggao, Zhang, Qingjie, Dravid, Vinayak P., Uher, Ctirad, Kanatzidis, Mercouri G., Tang, Xinfeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Association for the Advancement of Science 2018
Materias:
Research Articles
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5983911/
https://www.ncbi.nlm.nih.gov/pubmed/29868641
http://dx.doi.org/10.1126/sciadv.aar5606

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC5983911/
https://www.ncbi.nlm.nih.gov/pubmed/29868641
http://dx.doi.org/10.1126/sciadv.aar5606

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