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Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature
This paper review presents Single Event Effects (SEE) irradiation tests under heavy ions of the test-chip of D-Flip-Flop (DFF) cells and complete readout integrated circuits (ROIC) as a function of temperature, down to 50 K. The analyses of the experimental data are completed using the SEE predictio...
Autores principales: | , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6068564/ https://www.ncbi.nlm.nih.gov/pubmed/30022012 http://dx.doi.org/10.3390/s18072338 |
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author | Artola, Laurent Youssef, Ahmad Al Ducret, Samuel Perrier, Franck Buiron, Raphael Gilard, Olivier Mekki, Julien Boutillier, Mathieu Hubert, Guillaume Poivey, Christian |
author_facet | Artola, Laurent Youssef, Ahmad Al Ducret, Samuel Perrier, Franck Buiron, Raphael Gilard, Olivier Mekki, Julien Boutillier, Mathieu Hubert, Guillaume Poivey, Christian |
author_sort | Artola, Laurent |
collection | PubMed |
description | This paper review presents Single Event Effects (SEE) irradiation tests under heavy ions of the test-chip of D-Flip-Flop (DFF) cells and complete readout integrated circuits (ROIC) as a function of temperature, down to 50 K. The analyses of the experimental data are completed using the SEE prediction tool MUSCA SEP3. The conclusions derived from the experimental measurements and related analyses allow to update the current SEE radiation hardness assurance (RHA) for readout integrated circuits of infrared image sensors used at cryogenic temperatures. The current RHA update is performed on SEE irradiation tests at room temperature, as opposed to the operational cryogenic temperature. These tests include SET (Single Event Transient), SEU (Single Event Upset) and SEFI (Single Event Functional Interrupt) irradiation tests. This update allows for reducing the cost of ROIC qualifications and the test setup complexity for each space mission. |
format | Online Article Text |
id | pubmed-6068564 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-60685642018-08-07 Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature Artola, Laurent Youssef, Ahmad Al Ducret, Samuel Perrier, Franck Buiron, Raphael Gilard, Olivier Mekki, Julien Boutillier, Mathieu Hubert, Guillaume Poivey, Christian Sensors (Basel) Review This paper review presents Single Event Effects (SEE) irradiation tests under heavy ions of the test-chip of D-Flip-Flop (DFF) cells and complete readout integrated circuits (ROIC) as a function of temperature, down to 50 K. The analyses of the experimental data are completed using the SEE prediction tool MUSCA SEP3. The conclusions derived from the experimental measurements and related analyses allow to update the current SEE radiation hardness assurance (RHA) for readout integrated circuits of infrared image sensors used at cryogenic temperatures. The current RHA update is performed on SEE irradiation tests at room temperature, as opposed to the operational cryogenic temperature. These tests include SET (Single Event Transient), SEU (Single Event Upset) and SEFI (Single Event Functional Interrupt) irradiation tests. This update allows for reducing the cost of ROIC qualifications and the test setup complexity for each space mission. MDPI 2018-07-18 /pmc/articles/PMC6068564/ /pubmed/30022012 http://dx.doi.org/10.3390/s18072338 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Review Artola, Laurent Youssef, Ahmad Al Ducret, Samuel Perrier, Franck Buiron, Raphael Gilard, Olivier Mekki, Julien Boutillier, Mathieu Hubert, Guillaume Poivey, Christian Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title | Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title_full | Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title_fullStr | Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title_full_unstemmed | Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title_short | Update of Single Event Effects Radiation Hardness Assurance of Readout Integrated Circuit of Infrared Image Sensors at Cryogenic Temperature |
title_sort | update of single event effects radiation hardness assurance of readout integrated circuit of infrared image sensors at cryogenic temperature |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6068564/ https://www.ncbi.nlm.nih.gov/pubmed/30022012 http://dx.doi.org/10.3390/s18072338 |
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