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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection
The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this pap...
Autores principales: | Aryan, Pouria, Sampath, Santhakumar, Sohn, Hoon |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6068802/ https://www.ncbi.nlm.nih.gov/pubmed/29933589 http://dx.doi.org/10.3390/s18071981 |
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