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An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this pap...

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Detalles Bibliográficos
Autores principales:	Aryan, Pouria, Sampath, Santhakumar, Sohn, Hoon
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Review
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6068802/ https://www.ncbi.nlm.nih.gov/pubmed/29933589 http://dx.doi.org/10.3390/s18071981

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