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One-Step Laser Encapsulation of Nano-Cracking Strain Sensors

Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cau...

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Detalles Bibliográficos
Autores principales: Park, Chan, Jung, Hyunsuk, Lee, Hyunwoo, Hong, Sunguk, Kim, Hyonguk, Cho, Seong J.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6111580/
https://www.ncbi.nlm.nih.gov/pubmed/30110958
http://dx.doi.org/10.3390/s18082673
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author Park, Chan
Jung, Hyunsuk
Lee, Hyunwoo
Hong, Sunguk
Kim, Hyonguk
Cho, Seong J.
author_facet Park, Chan
Jung, Hyunsuk
Lee, Hyunwoo
Hong, Sunguk
Kim, Hyonguk
Cho, Seong J.
author_sort Park, Chan
collection PubMed
description Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cause noise and shorten the sensor lifetimes. This study reports the development of a nano-crack-based flexible sensor with mechanically, thermally, and chemically stable electrical characteristics in external environments using a novel one-step laser encapsulation (OLE) method optimized for thin films. The OLE process allows simultaneous patterning, cutting, and encapsulating of a device using laser cutting and thermoplastic polymers. The processes are simplified for economical and rapid production (one sensor in 8 s). Unlike other encapsulation methods, OLE does not degrade the performance of the sensor because the sensing layers remain unaffected. Sensors protected with OLE exhibit mechanical, thermal, and chemical stability under water-, heat-, dust-, and detergent-exposed conditions. Finally, a waterproof, flexible strain sensor is developed to detect motions around the eye, where oil and sweat are generated. OLE-based sensors can be used in several applications that are exposed to a large amount of foreign matter, such as humid or sweaty environments.
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spelling pubmed-61115802018-08-30 One-Step Laser Encapsulation of Nano-Cracking Strain Sensors Park, Chan Jung, Hyunsuk Lee, Hyunwoo Hong, Sunguk Kim, Hyonguk Cho, Seong J. Sensors (Basel) Article Development of flexible strain sensors that can be attached directly onto the skin, such as skin-mountable or wearable electronic devices, has recently attracted attention. However, such flexible sensors are generally exposed to various harsh environments, such as sweat, humidity, or dust, which cause noise and shorten the sensor lifetimes. This study reports the development of a nano-crack-based flexible sensor with mechanically, thermally, and chemically stable electrical characteristics in external environments using a novel one-step laser encapsulation (OLE) method optimized for thin films. The OLE process allows simultaneous patterning, cutting, and encapsulating of a device using laser cutting and thermoplastic polymers. The processes are simplified for economical and rapid production (one sensor in 8 s). Unlike other encapsulation methods, OLE does not degrade the performance of the sensor because the sensing layers remain unaffected. Sensors protected with OLE exhibit mechanical, thermal, and chemical stability under water-, heat-, dust-, and detergent-exposed conditions. Finally, a waterproof, flexible strain sensor is developed to detect motions around the eye, where oil and sweat are generated. OLE-based sensors can be used in several applications that are exposed to a large amount of foreign matter, such as humid or sweaty environments. MDPI 2018-08-14 /pmc/articles/PMC6111580/ /pubmed/30110958 http://dx.doi.org/10.3390/s18082673 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Park, Chan
Jung, Hyunsuk
Lee, Hyunwoo
Hong, Sunguk
Kim, Hyonguk
Cho, Seong J.
One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title_full One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title_fullStr One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title_full_unstemmed One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title_short One-Step Laser Encapsulation of Nano-Cracking Strain Sensors
title_sort one-step laser encapsulation of nano-cracking strain sensors
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6111580/
https://www.ncbi.nlm.nih.gov/pubmed/30110958
http://dx.doi.org/10.3390/s18082673
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