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CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant

Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises difficulty of storage and handling of copper powder, pa...

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Detalles Bibliográficos
Autores principales: Li, Shuangyi, Hou, Baosen, Dai, Dan, Shu, Shengcheng, Wu, Mingliang, Li, Ao, Han, Yu, Zhu, Zhi-xiang, Chen, Bao-an, Ding, Yi, Zhang, Qiang, Wang, Qiang, Jiang, Nan, Lin, Cheng-Te
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6119898/
https://www.ncbi.nlm.nih.gov/pubmed/30126127
http://dx.doi.org/10.3390/ma11081459
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author Li, Shuangyi
Hou, Baosen
Dai, Dan
Shu, Shengcheng
Wu, Mingliang
Li, Ao
Han, Yu
Zhu, Zhi-xiang
Chen, Bao-an
Ding, Yi
Zhang, Qiang
Wang, Qiang
Jiang, Nan
Lin, Cheng-Te
author_facet Li, Shuangyi
Hou, Baosen
Dai, Dan
Shu, Shengcheng
Wu, Mingliang
Li, Ao
Han, Yu
Zhu, Zhi-xiang
Chen, Bao-an
Ding, Yi
Zhang, Qiang
Wang, Qiang
Jiang, Nan
Lin, Cheng-Te
author_sort Li, Shuangyi
collection PubMed
description Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises difficulty of storage and handling of copper powder, particularly in the case of Cu microparticles. Here, we developed a thermal chemical vapor deposition chemical vapor deposition (CVD) process for large-scale synthesis of graphene coatings on Cu microparticles, which importantly can remain monodisperse without aggregation after graphene growth at high temperature by using removal spacers. Compared to other protective coating methods, the intrinsic electrical and thermal properties of Cu powder would not be degraded by uniform growth of low defect few-layer graphene on each particle surface. As a result, when the anticorrosion performance test was carried out by immersing the samples in Cu etchant, the corrosion rate of graphene/Cu microparticles was significantly improved (ca three times slower) compared to that of pristine Cu powder, also showing a comparable anticorrosion ability to commercial CuZn30 alloy.
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spelling pubmed-61198982018-09-05 CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant Li, Shuangyi Hou, Baosen Dai, Dan Shu, Shengcheng Wu, Mingliang Li, Ao Han, Yu Zhu, Zhi-xiang Chen, Bao-an Ding, Yi Zhang, Qiang Wang, Qiang Jiang, Nan Lin, Cheng-Te Materials (Basel) Communication Copper powder has broad applications in the powder metallurgy, heat exchanger, and electronic industries due to its intrinsically high electrical and thermal conductivities. However, the ease of formation of surface oxide or patina layer raises difficulty of storage and handling of copper powder, particularly in the case of Cu microparticles. Here, we developed a thermal chemical vapor deposition chemical vapor deposition (CVD) process for large-scale synthesis of graphene coatings on Cu microparticles, which importantly can remain monodisperse without aggregation after graphene growth at high temperature by using removal spacers. Compared to other protective coating methods, the intrinsic electrical and thermal properties of Cu powder would not be degraded by uniform growth of low defect few-layer graphene on each particle surface. As a result, when the anticorrosion performance test was carried out by immersing the samples in Cu etchant, the corrosion rate of graphene/Cu microparticles was significantly improved (ca three times slower) compared to that of pristine Cu powder, also showing a comparable anticorrosion ability to commercial CuZn30 alloy. MDPI 2018-08-17 /pmc/articles/PMC6119898/ /pubmed/30126127 http://dx.doi.org/10.3390/ma11081459 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Communication
Li, Shuangyi
Hou, Baosen
Dai, Dan
Shu, Shengcheng
Wu, Mingliang
Li, Ao
Han, Yu
Zhu, Zhi-xiang
Chen, Bao-an
Ding, Yi
Zhang, Qiang
Wang, Qiang
Jiang, Nan
Lin, Cheng-Te
CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title_full CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title_fullStr CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title_full_unstemmed CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title_short CVD Synthesis of Monodisperse Graphene/Cu Microparticles with High Corrosion Resistance in Cu Etchant
title_sort cvd synthesis of monodisperse graphene/cu microparticles with high corrosion resistance in cu etchant
topic Communication
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6119898/
https://www.ncbi.nlm.nih.gov/pubmed/30126127
http://dx.doi.org/10.3390/ma11081459
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