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Ga-Based Alloys in Microelectronic Interconnects: A Review
Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6119961/ https://www.ncbi.nlm.nih.gov/pubmed/30096828 http://dx.doi.org/10.3390/ma11081384 |
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author | Liu, Shiqian Sweatman, Keith McDonald, Stuart Nogita, Kazuhiro |
author_facet | Liu, Shiqian Sweatman, Keith McDonald, Stuart Nogita, Kazuhiro |
author_sort | Liu, Shiqian |
collection | PubMed |
description | Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry. |
format | Online Article Text |
id | pubmed-6119961 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-61199612018-09-05 Ga-Based Alloys in Microelectronic Interconnects: A Review Liu, Shiqian Sweatman, Keith McDonald, Stuart Nogita, Kazuhiro Materials (Basel) Review Gallium (Ga) and some of its alloys have a range of properties that make them an attractive option for microelectronic interconnects, including low melting point, non-toxicity, and the ability to wet without fluxing most materials—including oxides—found in microelectronics. Some of these properties result from their ability to form stable high melting temperature solid solutions and intermetallic compounds with other metals, such as copper, nickel, and aluminium. Ga and Ga-based alloys have already received significant attention in the scientific literature given their potential for use in the liquid state. Their potential for enabling the miniaturisation and deformability of microelectronic devices has also been demonstrated. The low process temperatures, made possible by their low melting points, produce significant energy savings. However, there are still some issues that need to be addressed before their potential can be fully realised. Characterising Ga and Ga-based alloys, and their reactions with materials commonly used in the microelectronic industry, are thus a priority for the electronics industry. This review provides a summary of research related to the applications and characterisation of Ga-based alloys. If the potential of Ga-based alloys for low temperature bonding in microelectronics manufacturing is to be realised, more work needs to be done on their interactions with the wide range of substrate materials now being used in electronic circuitry. MDPI 2018-08-08 /pmc/articles/PMC6119961/ /pubmed/30096828 http://dx.doi.org/10.3390/ma11081384 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Review Liu, Shiqian Sweatman, Keith McDonald, Stuart Nogita, Kazuhiro Ga-Based Alloys in Microelectronic Interconnects: A Review |
title | Ga-Based Alloys in Microelectronic Interconnects: A Review |
title_full | Ga-Based Alloys in Microelectronic Interconnects: A Review |
title_fullStr | Ga-Based Alloys in Microelectronic Interconnects: A Review |
title_full_unstemmed | Ga-Based Alloys in Microelectronic Interconnects: A Review |
title_short | Ga-Based Alloys in Microelectronic Interconnects: A Review |
title_sort | ga-based alloys in microelectronic interconnects: a review |
topic | Review |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6119961/ https://www.ncbi.nlm.nih.gov/pubmed/30096828 http://dx.doi.org/10.3390/ma11081384 |
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