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Preparation and characterization of fast-curing powder epoxy adhesive at middle temperature
At present, the disadvantage of powder epoxy adhesive is the limited application area. In order to widen the application range of powder epoxy adhesive from heat-resistant substrates (such as metals) to heat-sensitive substrates (such as plastic products, cardboard and wood), it is necessary to decr...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
The Royal Society
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6124101/ https://www.ncbi.nlm.nih.gov/pubmed/30225049 http://dx.doi.org/10.1098/rsos.180566 |