Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient

A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, furthe...

Descripción completa

Detalles Bibliográficos
Autores principales: Juang, Jing-Ye, Lu, Chia-Ling, Chen, Kuan-Ju, Chen, Chao-Chang A., Hsu, Po-Ning, Chen, Chih, Tu, K. N.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6141480/
https://www.ncbi.nlm.nih.gov/pubmed/30224717
http://dx.doi.org/10.1038/s41598-018-32280-x
_version_ 1783355704787075072
author Juang, Jing-Ye
Lu, Chia-Ling
Chen, Kuan-Ju
Chen, Chao-Chang A.
Hsu, Po-Ning
Chen, Chih
Tu, K. N.
author_facet Juang, Jing-Ye
Lu, Chia-Ling
Chen, Kuan-Ju
Chen, Chao-Chang A.
Hsu, Po-Ning
Chen, Chih
Tu, K. N.
author_sort Juang, Jing-Ye
collection PubMed
description A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed.
format Online
Article
Text
id pubmed-6141480
institution National Center for Biotechnology Information
language English
publishDate 2018
publisher Nature Publishing Group UK
record_format MEDLINE/PubMed
spelling pubmed-61414802018-09-20 Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient Juang, Jing-Ye Lu, Chia-Ling Chen, Kuan-Ju Chen, Chao-Chang A. Hsu, Po-Ning Chen, Chih Tu, K. N. Sci Rep Article A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, further annealing in the temperature gradient, as well as in a reversed temperature gradient, was performed. They showed similar recrystallization behavior with de-twinning. To analyze the de-twinning, we recall the classic model of annealing twin formation by Fullman and Fisher as comparison. Our case is opposite to the model of Fullman and Fisher. A mechanism of direct bonding by surface diffusion creep is proposed. Nature Publishing Group UK 2018-09-17 /pmc/articles/PMC6141480/ /pubmed/30224717 http://dx.doi.org/10.1038/s41598-018-32280-x Text en © The Author(s) 2018 Open Access This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Commons license, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons license, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons license and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this license, visit http://creativecommons.org/licenses/by/4.0/.
spellingShingle Article
Juang, Jing-Ye
Lu, Chia-Ling
Chen, Kuan-Ju
Chen, Chao-Chang A.
Hsu, Po-Ning
Chen, Chih
Tu, K. N.
Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title_full Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title_fullStr Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title_full_unstemmed Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title_short Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
title_sort copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6141480/
https://www.ncbi.nlm.nih.gov/pubmed/30224717
http://dx.doi.org/10.1038/s41598-018-32280-x
work_keys_str_mv AT juangjingye coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT luchialing coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT chenkuanju coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT chenchaochanga coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT hsuponing coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT chenchih coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient
AT tukn coppertocopperdirectbondingonhighly111orientednanotwinnedcopperinnovacuumambient

Ejemplares similares