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Copper-to-copper direct bonding on highly (111)-oriented nanotwinned copper in no-vacuum ambient
A vacuum-free Cu-to-Cu direct bonding by using (111)-oriented and nanotwinned Cu has been achieved. A fast bonding process occurs in 5 min under a temperature gradient between 450 and 100 °C. It is verified by grain growth across the bonded interface. To investigate the grain growth behavior, furthe...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6141480/ https://www.ncbi.nlm.nih.gov/pubmed/30224717 http://dx.doi.org/10.1038/s41598-018-32280-x |