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High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior

This study reports the realization of an optical cochlear implant (oCI) with optimized thermomechanical properties for optogenetic experiments. The oCI probe comprises 144 miniaturized light-emitting diodes (μLEDs) distributed along a bendable, 1.5-cm-long, 350-μm-wide and 26-μm-thick probe shaft, i...

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Detalles Bibliográficos
Autores principales: Klein, Eric, Gossler, Christian, Paul, Oliver, Ruther, Patrick
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Frontiers Media S.A. 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6174235/
https://www.ncbi.nlm.nih.gov/pubmed/30327585
http://dx.doi.org/10.3389/fnins.2018.00659
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author Klein, Eric
Gossler, Christian
Paul, Oliver
Ruther, Patrick
author_facet Klein, Eric
Gossler, Christian
Paul, Oliver
Ruther, Patrick
author_sort Klein, Eric
collection PubMed
description This study reports the realization of an optical cochlear implant (oCI) with optimized thermomechanical properties for optogenetic experiments. The oCI probe comprises 144 miniaturized light-emitting diodes (μLEDs) distributed along a bendable, 1.5-cm-long, 350-μm-wide and 26-μm-thick probe shaft, individually controlled via a n × p matrix interconnection. In contrast to our earlier approach based on polyimide (PI) and epoxy resin with different thermal expansion coefficients, the μLEDs and interconnecting wires are now embedded into a triple-layer stack of a single, biocompatible, and highly transparent epoxy material. The new material combination results in a pronounced reduction of thermomechanical bending in comparison with the material pair of the earlier approach. We developed a spin-coating process enabling epoxy resin layers down to 5 μm at thickness variations of less than 7% across the entire carrier wafer. We observed that the cross-linking of epoxy resin layers strongly depends on the spin-coating parameters which were found to be correlated to a potential separation of epoxy resin components of different densities. Furthermore, various metallization layers and corresponding adhesion promoting layers were investigated. We identified the combination of silicon carbide with a titanium-based metallization to provide the highest peeling strength, achieving an adhesion to epoxy improved by a factor of two. In order to obtain a high process yield, we established a stress-free implant release using the electrochemical dissolution of a sacrificial aluminum layer. The direct comparison of oCI probe variants using a single epoxy material and the combination of PI and epoxy resin revealed that the epoxy-resin-only probe shows minimal thermomechanical probe bending with a negligible hysteresis. The thermal probe characterization demonstrated that the temperature increase is limited to 1 K at μLED DC currents of up to 10 mA depending on the stimulation duration and the medium surrounding the probe. The optical output power and peak wavelengths of the new oCI variant were extracted to be 0.82 mW and 462 nm when operating the μLEDs at 10 mA, 10 kHz, and a duty cycle of 10%. The optical power corresponds to a radiant emittance of 407 mW/mm(2), sufficient for optogenetic experiments using channelrhodopsin-2.
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spelling pubmed-61742352018-10-16 High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior Klein, Eric Gossler, Christian Paul, Oliver Ruther, Patrick Front Neurosci Neuroscience This study reports the realization of an optical cochlear implant (oCI) with optimized thermomechanical properties for optogenetic experiments. The oCI probe comprises 144 miniaturized light-emitting diodes (μLEDs) distributed along a bendable, 1.5-cm-long, 350-μm-wide and 26-μm-thick probe shaft, individually controlled via a n × p matrix interconnection. In contrast to our earlier approach based on polyimide (PI) and epoxy resin with different thermal expansion coefficients, the μLEDs and interconnecting wires are now embedded into a triple-layer stack of a single, biocompatible, and highly transparent epoxy material. The new material combination results in a pronounced reduction of thermomechanical bending in comparison with the material pair of the earlier approach. We developed a spin-coating process enabling epoxy resin layers down to 5 μm at thickness variations of less than 7% across the entire carrier wafer. We observed that the cross-linking of epoxy resin layers strongly depends on the spin-coating parameters which were found to be correlated to a potential separation of epoxy resin components of different densities. Furthermore, various metallization layers and corresponding adhesion promoting layers were investigated. We identified the combination of silicon carbide with a titanium-based metallization to provide the highest peeling strength, achieving an adhesion to epoxy improved by a factor of two. In order to obtain a high process yield, we established a stress-free implant release using the electrochemical dissolution of a sacrificial aluminum layer. The direct comparison of oCI probe variants using a single epoxy material and the combination of PI and epoxy resin revealed that the epoxy-resin-only probe shows minimal thermomechanical probe bending with a negligible hysteresis. The thermal probe characterization demonstrated that the temperature increase is limited to 1 K at μLED DC currents of up to 10 mA depending on the stimulation duration and the medium surrounding the probe. The optical output power and peak wavelengths of the new oCI variant were extracted to be 0.82 mW and 462 nm when operating the μLEDs at 10 mA, 10 kHz, and a duty cycle of 10%. The optical power corresponds to a radiant emittance of 407 mW/mm(2), sufficient for optogenetic experiments using channelrhodopsin-2. Frontiers Media S.A. 2018-10-01 /pmc/articles/PMC6174235/ /pubmed/30327585 http://dx.doi.org/10.3389/fnins.2018.00659 Text en Copyright © 2018 Klein, Gossler, Paul and Ruther. http://creativecommons.org/licenses/by/4.0/ This is an open-access article distributed under the terms of the Creative Commons Attribution License (CC BY). The use, distribution or reproduction in other forums is permitted, provided the original author(s) and the copyright owner(s) are credited and that the original publication in this journal is cited, in accordance with accepted academic practice. No use, distribution or reproduction is permitted which does not comply with these terms.
spellingShingle Neuroscience
Klein, Eric
Gossler, Christian
Paul, Oliver
Ruther, Patrick
High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title_full High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title_fullStr High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title_full_unstemmed High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title_short High-Density μLED-Based Optical Cochlear Implant With Improved Thermomechanical Behavior
title_sort high-density μled-based optical cochlear implant with improved thermomechanical behavior
topic Neuroscience
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6174235/
https://www.ncbi.nlm.nih.gov/pubmed/30327585
http://dx.doi.org/10.3389/fnins.2018.00659
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