Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

A radio-frequency micro-electro-mechanical system (RF MEMS) wafer-level packaging (WLP) method using pre-patterned benzo-cyclo-butene (BCB) polymers with a high-resistivity silicon cap is proposed to achieve high bonding quality and excellent RF performance. In this process, the BCB polymer was pre-...

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Detalles Bibliográficos
Autores principales: Gong, Zhuhao, Zhang, Yulong, Guo, Xin, Liu, Zewen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187652/
https://www.ncbi.nlm.nih.gov/pubmed/30424027
http://dx.doi.org/10.3390/mi9030093

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187652/
https://www.ncbi.nlm.nih.gov/pubmed/30424027
http://dx.doi.org/10.3390/mi9030093

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