Hard-Baked Photoresist as a Sacrificial Layer for Sub-180 °C Surface Micromachining Processes

This letter proposes a method for utilizing a positive photoresist, Shipley 1805, as a sacrificial layer for sub-180 °C fabrication process flows. In the proposed process, the sacrificial layer is etched at the end to release the structures using a relatively fast wet-etching technique employing res...

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Detalles Bibliográficos
Autores principales: Tawfik, Hani H., Elsayed, Mohannad Y., Nabki, Frederic, El-Gamal, Mourad N.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Letter
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6187695/
https://www.ncbi.nlm.nih.gov/pubmed/30424164
http://dx.doi.org/10.3390/mi9050231

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