Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...

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Detalles Bibliográficos
Autores principales: Bleiker, Simon J., Visser Taklo, Maaike M., Lietaer, Nicolas, Vogl, Andreas, Bakke, Thor, Niklaus, Frank
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189772/
https://www.ncbi.nlm.nih.gov/pubmed/30404365
http://dx.doi.org/10.3390/mi7100192

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189772/
https://www.ncbi.nlm.nih.gov/pubmed/30404365
http://dx.doi.org/10.3390/mi7100192

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