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Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding

This paper presents a fabrication method of capacitive micromachined ultrasonic transducers (CMUTs) by wafer direct bonding, which utilizes both the wet chemical and O(2) plasma activation processes to decrease the bonding temperature to 400 °C. Two key surface properties, the contact angle and surf...

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Detalles Bibliográficos
Autores principales:	Wang, Xiaoqing, Yu, Yude, Ning, Jin
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2016
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189800/ https://www.ncbi.nlm.nih.gov/pubmed/30404398 http://dx.doi.org/10.3390/mi7120226

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