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One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin

A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the...

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Detalles Bibliográficos
Autores principales: Cui, Yun, Li, Yuhang, Xing, Yufeng, Yang, Tianzhi, Song, Jizhou
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189900/
https://www.ncbi.nlm.nih.gov/pubmed/30404381
http://dx.doi.org/10.3390/mi7110210
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author Cui, Yun
Li, Yuhang
Xing, Yufeng
Yang, Tianzhi
Song, Jizhou
author_facet Cui, Yun
Li, Yuhang
Xing, Yufeng
Yang, Tianzhi
Song, Jizhou
author_sort Cui, Yun
collection PubMed
description A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications.
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spelling pubmed-61899002018-11-01 One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin Cui, Yun Li, Yuhang Xing, Yufeng Yang, Tianzhi Song, Jizhou Micromachines (Basel) Article A one-dimensional analytic thermal model for the flexible electronic devices integrated with human skin under a constant and pulsed power is developed. The Fourier heat conduction equation is adopted for the flexible electronics devices while the Pennes bio-heat transfer equation is adopted for the skin tissue. Finite element analysis is performed to validate the analytic model through the comparison of temperature distributions in the system. The influences of geometric and loading parameters on the temperature increase under a pulsed power are investigated. It is shown that a small duty cycle can reduce the temperature increase of the system effectively. A thin substrate can reduce the device temperature but increase the skin surface temperature. The results presented may be helpful to optimize the design of flexible electronic devices to reduce the adverse thermal influences in bio-integrated applications. MDPI 2016-11-18 /pmc/articles/PMC6189900/ /pubmed/30404381 http://dx.doi.org/10.3390/mi7110210 Text en © 2016 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC-BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Cui, Yun
Li, Yuhang
Xing, Yufeng
Yang, Tianzhi
Song, Jizhou
One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title_full One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title_fullStr One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title_full_unstemmed One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title_short One-Dimensional Thermal Analysis of the Flexible Electronic Devices Integrated with Human Skin
title_sort one-dimensional thermal analysis of the flexible electronic devices integrated with human skin
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189900/
https://www.ncbi.nlm.nih.gov/pubmed/30404381
http://dx.doi.org/10.3390/mi7110210
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