PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices

Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process p...

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Detalles Bibliográficos
Autores principales: Song, In-Hyouk, Park, Taehyun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189942/
https://www.ncbi.nlm.nih.gov/pubmed/30400474
http://dx.doi.org/10.3390/mi8090284
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author Song, In-Hyouk
Park, Taehyun
author_facet Song, In-Hyouk
Park, Taehyun
author_sort Song, In-Hyouk
collection PubMed
description Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers—PMMA to polycarbonate (PC)—to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection.
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spelling pubmed-61899422018-11-01 PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices Song, In-Hyouk Park, Taehyun Micromachines (Basel) Article Recently, thermoplastic polymers have become popular materials for microfluidic chips due to their easy fabrication and low cost. A polymer based microfluidic device can be formed in various fabrication techniques such as laser machining, injection molding, and hot embossing. A new bonding process presented in this paper uses a 2.5% (w/w) polymethyl methacrylate (PMMA) solution as an adhesive layer to bond dissimilar polymers—PMMA to polycarbonate (PC)—to enclose the PMMA microfluidic channels with PC. This technique has been successfully demonstrated to bond PMMA microchip to PC film. This paper presents bonding strength using a shear strength test and a crack opening method in addition to the fluidic leakage inspection. MDPI 2017-09-20 /pmc/articles/PMC6189942/ /pubmed/30400474 http://dx.doi.org/10.3390/mi8090284 Text en © 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Song, In-Hyouk
Park, Taehyun
PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title_full PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title_fullStr PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title_full_unstemmed PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title_short PMMA Solution Assisted Room Temperature Bonding for PMMA–PC Hybrid Devices
title_sort pmma solution assisted room temperature bonding for pmma–pc hybrid devices
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6189942/
https://www.ncbi.nlm.nih.gov/pubmed/30400474
http://dx.doi.org/10.3390/mi8090284
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AT parktaehyun pmmasolutionassistedroomtemperaturebondingforpmmapchybriddevices

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