Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

Plasma- and water-assisted oxide-oxide thermocompression direct bonding for a self-assembly based multichip-to-wafer (MCtW) 3D integration approach was demonstrated. The bonding yields and bonding strengths of the self-assembled chips obtained by the MCtW direct bonding technology were evaluated. In...

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Detalles Bibliográficos
Autores principales: Fukushima, Takafumi, Hashiguchi, Hideto, Yonekura, Hiroshi, Kino, Hisashi, Murugesan, Mariappan, Bea, Ji-Chel, Lee, Kang-Wook, Tanaka, Tetsu, Koyanagi, Mitsumasa
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190075/
https://www.ncbi.nlm.nih.gov/pubmed/30404357
http://dx.doi.org/10.3390/mi7100184

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