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Investigation of Au/Si Eutectic Wafer Bonding for MEMS Accelerometers

Au/Si eutectic bonding is considered to BE a promising technology for creating 3D structures and hermetic packaging in micro-electro-mechanical system (MEMS) devices. However, it suffers from the problems of a non-uniform bonding interface and complex processes for the interconnection of metal wires...

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Detalles Bibliográficos
Autores principales: Li, Dongling, Shang, Zhengguo, She, Yin, Wen, Zhiyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2017
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190183/
http://dx.doi.org/10.3390/mi8050158

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