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Compensation Method for Die Shift Caused by Flow Drag Force in Wafer-Level Molding Process
Wafer-level packaging (WLP) is a next-generation semiconductor packaging technology that is important for realizing high-performance and ultra-thin semiconductor devices. However, the molding process, which is a part of the WLP process, has various problems such as a high defect rate and low predict...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
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MDPI
2016
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| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6190190/ https://www.ncbi.nlm.nih.gov/pubmed/30404269 http://dx.doi.org/10.3390/mi7060095 |