Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)

The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al....

Descripción completa

Detalles Bibliográficos
Autores principales: Knapp, Caroline E., Metcalf, Elizabeth A., Mrig, Shreya, Sanchez‐Perez, Clara, Douglas, Samuel. P., Choquet, Patrick, Boscher, Nicolas D.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2018
Materias:
Cover Pictures
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6208187/
http://dx.doi.org/10.1002/open.201800200
_version_ 1783366664396472320
author Knapp, Caroline E.
Metcalf, Elizabeth A.
Mrig, Shreya
Sanchez‐Perez, Clara
Douglas, Samuel. P.
Choquet, Patrick
Boscher, Nicolas D.
author_facet Knapp, Caroline E.
Metcalf, Elizabeth A.
Mrig, Shreya
Sanchez‐Perez, Clara
Douglas, Samuel. P.
Choquet, Patrick
Boscher, Nicolas D.
author_sort Knapp, Caroline E.
collection PubMed
description The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al. on page 850 in Issue 11, 2018 (DOI: https://doi.org/10.1002/open.201800131).[Image: see text]
format Online
Article
Text
id pubmed-6208187
institution National Center for Biotechnology Information
language English
publishDate 2018
publisher John Wiley and Sons Inc.
record_format MEDLINE/PubMed
spelling pubmed-62081872018-11-06 Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018) Knapp, Caroline E. Metcalf, Elizabeth A. Mrig, Shreya Sanchez‐Perez, Clara Douglas, Samuel. P. Choquet, Patrick Boscher, Nicolas D. ChemistryOpen Cover Pictures The Cover Feature shows bidentate diamine and amino‐alcohol ligands, which are used to form solid, water‐soluble, and air‐stable monomeric copper complexes for low‐temperature plasma‐assisted inkjet printing of conductive copper. More information can be found in the Full Paper by C. E. Knapp et al. on page 850 in Issue 11, 2018 (DOI: https://doi.org/10.1002/open.201800131).[Image: see text] John Wiley and Sons Inc. 2018-10-08 /pmc/articles/PMC6208187/ http://dx.doi.org/10.1002/open.201800200 Text en © 2018 Wiley‐VCH Verlag GmbH & Co. KGaA, Weinheim
spellingShingle Cover Pictures
Knapp, Caroline E.
Metcalf, Elizabeth A.
Mrig, Shreya
Sanchez‐Perez, Clara
Douglas, Samuel. P.
Choquet, Patrick
Boscher, Nicolas D.
Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title_full Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title_fullStr Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title_full_unstemmed Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title_short Cover Feature: Precursors for Atmospheric Plasma‐Enhanced Sintering: Low‐Temperature Inkjet Printing of Conductive Copper (ChemistryOpen 11/2018)
title_sort cover feature: precursors for atmospheric plasma‐enhanced sintering: low‐temperature inkjet printing of conductive copper (chemistryopen 11/2018)
topic Cover Pictures
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6208187/
http://dx.doi.org/10.1002/open.201800200
work_keys_str_mv AT knappcarolinee coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT metcalfelizabetha coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT mrigshreya coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT sanchezperezclara coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT douglassamuelp coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT choquetpatrick coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018
AT boschernicolasd coverfeatureprecursorsforatmosphericplasmaenhancedsinteringlowtemperatureinkjetprintingofconductivecopperchemistryopen112018

Ejemplares similares