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Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles
A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe(2)O(4) particles. The main influencing factors, including NiCl(2)·6H(2)O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized by...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6213431/ https://www.ncbi.nlm.nih.gov/pubmed/30249993 http://dx.doi.org/10.3390/ma11101810 |
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author | Ma, Junfei Zhang, Zhigang Liu, Yihan Zhang, Xiao Luo, Hongjie Yao, Guangchun |
author_facet | Ma, Junfei Zhang, Zhigang Liu, Yihan Zhang, Xiao Luo, Hongjie Yao, Guangchun |
author_sort | Ma, Junfei |
collection | PubMed |
description | A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe(2)O(4) particles. The main influencing factors, including NiCl(2)·6H(2)O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized by scanning electron microscopy. It was found that a more uniform and compact Ni-P coating layer was successfully formed by electroless plating via Pd-free activation pretreatment than Pd as sited plating. The coating layers plated by Pd-free activation pretreatment were thicker than those by the sensitization and activation pretreatment on average (9 vs. 5 μm). The new process did not need conventional sensitization or activation pretreatments, because the Ni particles dispersed uniformly on the NiFe(2)O(4) substrate became catalytic activation sites for nickel electroless plating. Such improvement was beneficial to shortening the preparation process and reducing the production costs with the use of noble metal Pd. |
format | Online Article Text |
id | pubmed-6213431 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-62134312018-11-14 Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles Ma, Junfei Zhang, Zhigang Liu, Yihan Zhang, Xiao Luo, Hongjie Yao, Guangchun Materials (Basel) Article A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe(2)O(4) particles. The main influencing factors, including NiCl(2)·6H(2)O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized by scanning electron microscopy. It was found that a more uniform and compact Ni-P coating layer was successfully formed by electroless plating via Pd-free activation pretreatment than Pd as sited plating. The coating layers plated by Pd-free activation pretreatment were thicker than those by the sensitization and activation pretreatment on average (9 vs. 5 μm). The new process did not need conventional sensitization or activation pretreatments, because the Ni particles dispersed uniformly on the NiFe(2)O(4) substrate became catalytic activation sites for nickel electroless plating. Such improvement was beneficial to shortening the preparation process and reducing the production costs with the use of noble metal Pd. MDPI 2018-09-24 /pmc/articles/PMC6213431/ /pubmed/30249993 http://dx.doi.org/10.3390/ma11101810 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Ma, Junfei Zhang, Zhigang Liu, Yihan Zhang, Xiao Luo, Hongjie Yao, Guangchun Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title | Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title_full | Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title_fullStr | Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title_full_unstemmed | Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title_short | Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles |
title_sort | pd-free activation pretreatment for electroless ni-p plating on nife(2)o(4) particles |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6213431/ https://www.ncbi.nlm.nih.gov/pubmed/30249993 http://dx.doi.org/10.3390/ma11101810 |
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