Pd-Free Activation Pretreatment for Electroless Ni-P Plating on NiFe(2)O(4) Particles

A Pd-free activation pretreatment process was developed for electroless Ni-P plating on NiFe(2)O(4) particles. The main influencing factors, including NiCl(2)·6H(2)O concentration, pH of electroless bath and temperature, were investigated. Microstructures of the coating layers were characterized by...

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Detalles Bibliográficos
Autores principales: Ma, Junfei, Zhang, Zhigang, Liu, Yihan, Zhang, Xiao, Luo, Hongjie, Yao, Guangchun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6213431/
https://www.ncbi.nlm.nih.gov/pubmed/30249993
http://dx.doi.org/10.3390/ma11101810

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6213431/
https://www.ncbi.nlm.nih.gov/pubmed/30249993
http://dx.doi.org/10.3390/ma11101810

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