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3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor

Wearable fiber‐shaped electronic devices have drawn abundant attention in scientific research fields, and tremendous efforts are dedicated to the development of various fiber‐shaped devices that possess sufficient flexibility. However, most studies suffer from persistent limitations in fabrication c...

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Detalles Bibliográficos
Autores principales: Zhao, Jingxin, Zhang, Yan, Huang, Yinan, Xie, Jixun, Zhao, Xiaoxin, Li, Chaowei, Qu, Jingyi, Zhang, Qichong, Sun, Juan, He, Bing, Li, Qiulong, Lu, Conghua, Xu, Xinhua, Lu, Weibang, Li, Liqiang, Yao, Yagang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: John Wiley and Sons Inc. 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6247048/
https://www.ncbi.nlm.nih.gov/pubmed/30479935
http://dx.doi.org/10.1002/advs.201801114
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author Zhao, Jingxin
Zhang, Yan
Huang, Yinan
Xie, Jixun
Zhao, Xiaoxin
Li, Chaowei
Qu, Jingyi
Zhang, Qichong
Sun, Juan
He, Bing
Li, Qiulong
Lu, Conghua
Xu, Xinhua
Lu, Weibang
Li, Liqiang
Yao, Yagang
author_facet Zhao, Jingxin
Zhang, Yan
Huang, Yinan
Xie, Jixun
Zhao, Xiaoxin
Li, Chaowei
Qu, Jingyi
Zhang, Qichong
Sun, Juan
He, Bing
Li, Qiulong
Lu, Conghua
Xu, Xinhua
Lu, Weibang
Li, Liqiang
Yao, Yagang
author_sort Zhao, Jingxin
collection PubMed
description Wearable fiber‐shaped electronic devices have drawn abundant attention in scientific research fields, and tremendous efforts are dedicated to the development of various fiber‐shaped devices that possess sufficient flexibility. However, most studies suffer from persistent limitations in fabrication cost, efficiency, the preparation procedure, and scalability that impede their practical application in flexible and wearable fields. In this study, a simple, low‐cost 3D printing method capable of high manufacturing efficiency, scalability, and complexity capability to fabricate a fiber‐shaped integrated device that combines printed fiber‐shaped temperature sensors (FTSs) with printed fiber‐shaped asymmetric supercapacitors (FASCs) is developed. The FASCs device can provide stable output power to FTSs. Moreover, the temperature responsivity of the integrated device is 1.95% °C(−1).
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spelling pubmed-62470482018-11-26 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor Zhao, Jingxin Zhang, Yan Huang, Yinan Xie, Jixun Zhao, Xiaoxin Li, Chaowei Qu, Jingyi Zhang, Qichong Sun, Juan He, Bing Li, Qiulong Lu, Conghua Xu, Xinhua Lu, Weibang Li, Liqiang Yao, Yagang Adv Sci (Weinh) Full Papers Wearable fiber‐shaped electronic devices have drawn abundant attention in scientific research fields, and tremendous efforts are dedicated to the development of various fiber‐shaped devices that possess sufficient flexibility. However, most studies suffer from persistent limitations in fabrication cost, efficiency, the preparation procedure, and scalability that impede their practical application in flexible and wearable fields. In this study, a simple, low‐cost 3D printing method capable of high manufacturing efficiency, scalability, and complexity capability to fabricate a fiber‐shaped integrated device that combines printed fiber‐shaped temperature sensors (FTSs) with printed fiber‐shaped asymmetric supercapacitors (FASCs) is developed. The FASCs device can provide stable output power to FTSs. Moreover, the temperature responsivity of the integrated device is 1.95% °C(−1). John Wiley and Sons Inc. 2018-09-25 /pmc/articles/PMC6247048/ /pubmed/30479935 http://dx.doi.org/10.1002/advs.201801114 Text en © 2018 The Authors. Published by WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim This is an open access article under the terms of the http://creativecommons.org/licenses/by/4.0/ License, which permits use, distribution and reproduction in any medium, provided the original work is properly cited.
spellingShingle Full Papers
Zhao, Jingxin
Zhang, Yan
Huang, Yinan
Xie, Jixun
Zhao, Xiaoxin
Li, Chaowei
Qu, Jingyi
Zhang, Qichong
Sun, Juan
He, Bing
Li, Qiulong
Lu, Conghua
Xu, Xinhua
Lu, Weibang
Li, Liqiang
Yao, Yagang
3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title_full 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title_fullStr 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title_full_unstemmed 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title_short 3D Printing Fiber Electrodes for an All‐Fiber Integrated Electronic Device via Hybridization of an Asymmetric Supercapacitor and a Temperature Sensor
title_sort 3d printing fiber electrodes for an all‐fiber integrated electronic device via hybridization of an asymmetric supercapacitor and a temperature sensor
topic Full Papers
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6247048/
https://www.ncbi.nlm.nih.gov/pubmed/30479935
http://dx.doi.org/10.1002/advs.201801114
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