Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

We have proposed a high temperature die attach method with porous Ag sheet as an interlayer for power device packaging. Sn-3.5Ag solder paste can infiltrate into the porous Ag sheet through capillary forces and Sn can react with the porous Ag sheet and Ag metallizations at the interfaces to form Ag(3)Sn after reflow at 260 °C for 10 min. The large specific surface area and the high diffusion rates between Ag and Sn accelerate the Sn consumption in the porous Ag structure, thus significantly reducing the processing time. The difference of the melting points of the die attach material before and after reflow could be expanded as large as 259 °C. The bondlines show good electrical and thermal conductivities. Furthermore, the average shear strength of the bondlines at 300 °C is higher than 20 MPa. The porous Ag skeleton remained in the bondline would contribute greatly to the heat dissipation and the electrical signal transmission in power devices.