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Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging
We have proposed a high temperature die attach method with porous Ag sheet as an interlayer for power device packaging. Sn-3.5Ag solder paste can infiltrate into the porous Ag sheet through capillary forces and Sn can react with the porous Ag sheet and Ag metallizations at the interfaces to form Ag(...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2018
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6258676/ https://www.ncbi.nlm.nih.gov/pubmed/30479399 http://dx.doi.org/10.1038/s41598-018-35708-6 |