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Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging

We have proposed a high temperature die attach method with porous Ag sheet as an interlayer for power device packaging. Sn-3.5Ag solder paste can infiltrate into the porous Ag sheet through capillary forces and Sn can react with the porous Ag sheet and Ag metallizations at the interfaces to form Ag(...

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Detalles Bibliográficos
Autores principales:	Hang, Chunjin, He, Junjian, Zhang, Zhihao, Chen, Hongtao, Li, Mingyu
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	Nature Publishing Group UK 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6258676/ https://www.ncbi.nlm.nih.gov/pubmed/30479399 http://dx.doi.org/10.1038/s41598-018-35708-6

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