Influence of Manufacturing Mechanical and Thermal Histories on Dimensional Stabilities of FR4 Laminate and FR4/Cu-Plated Holes

Irreversible dimension changes of an FR4 laminate board in the z-direction and FR4 laminate/Cu plated holes that depend on their manufacturing histories have been studied by thermal mechanical analysis in the temperature range from room temperature to 240 °C. It is found that the compression residual stresses generated in both materials due to manufacturing pressing are released during heating, leading to an elongation in the specified direction. This increase depends on the composition of the studied composite and number of pressing cycles. The second reason for the observed dimensional changes is insufficient curing during manufacture that causes post-curing after the first heating cycle and related board shrinkage in the z-direction. The temperature regions of these two processes are not the same. The post-curing process occurs in the transition temperature range (near the glass transition temperature), whereas the release of the compression residual stress is observed at higher temperatures. Both these processes are temperature-dependent and do not proceed to completion during one heating cycle. Moreover, the compression residual stress strongly influences the post-curing process.