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Imaging the Polymorphic Transformation in a Single Cu(6)Sn(5) Grain in a Solder Joint

In-situ observations of the polymorphic transformation in a single targeted Cu(6)Sn(5) grain constrained between Sn-0.7 wt % Cu solder and Cu-Cu(3)Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (H...

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Detalles Bibliográficos
Autores principales:	Somidin, Flora, Maeno, Hiroshi, Tran, Xuan Quy, D. McDonald, Stuart, Mohd Salleh, Mohd Arif Anuar, Matsumura, Syo, Nogita, Kazuhiro
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266603/ https://www.ncbi.nlm.nih.gov/pubmed/30423946 http://dx.doi.org/10.3390/ma11112229

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