Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic

This paper presents fabrication and packaging of a capacitive micromachined ultrasonic transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC). Anodic bonding of LTCC with Au vias-silicon on insulator (SOI) has been used to fabricate CMUTs with different membrane radii, 2...

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Detalles Bibliográficos
Autores principales: Yildiz, Fikret, Matsunaga, Tadao, Haga, Yoichi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266907/
https://www.ncbi.nlm.nih.gov/pubmed/30715052
http://dx.doi.org/10.3390/mi9110553

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266907/
https://www.ncbi.nlm.nih.gov/pubmed/30715052
http://dx.doi.org/10.3390/mi9110553

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