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Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic

This paper presents fabrication and packaging of a capacitive micromachined ultrasonic transducer (CMUT) using anodically bondable low temperature co-fired ceramic (LTCC). Anodic bonding of LTCC with Au vias-silicon on insulator (SOI) has been used to fabricate CMUTs with different membrane radii, 2...

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Detalles Bibliográficos
Autores principales:	Yildiz, Fikret, Matsunaga, Tadao, Haga, Yoichi
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6266907/ https://www.ncbi.nlm.nih.gov/pubmed/30715052 http://dx.doi.org/10.3390/mi9110553

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