Cargando…
Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper
Polymethylsilsesquioxane (PMSQ) nanoparticles with mass percentages of 0, 2.5, 5.0, 7.2, 9.4 wt %, respectively, were constructed by molecular dynamics methods in this paper. Composite molecular models were established using PMSQ and MPIA (poly-metaphenylene isophthalamide) fiber. The influence of d...
Autores principales: | , , , , |
---|---|
Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
|
Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6267194/ https://www.ncbi.nlm.nih.gov/pubmed/30463181 http://dx.doi.org/10.3390/ma11112317 |
_version_ | 1783376011433345024 |
---|---|
author | Zheng, Wei Xie, Jufang Zhang, Jingwen Tang, Chao Zhao, Zhongyong |
author_facet | Zheng, Wei Xie, Jufang Zhang, Jingwen Tang, Chao Zhao, Zhongyong |
author_sort | Zheng, Wei |
collection | PubMed |
description | Polymethylsilsesquioxane (PMSQ) nanoparticles with mass percentages of 0, 2.5, 5.0, 7.2, 9.4 wt %, respectively, were constructed by molecular dynamics methods in this paper. Composite molecular models were established using PMSQ and MPIA (poly-metaphenylene isophthalamide) fiber. The influence of different PMSQ contents on the thermal stability of meta-aramid insulation paper was analyzed from the parameters of mechanical property, interaction energy, and mean square displacement. The results showed that the trend of mechanical properties decreased with the increase of PMSQ content. When the PMSQ content was 2.5 wt %, the mechanical properties of the composited model were the best, which was about 24% higher than that of the unmodified model. From an intermolecular bonding and nonbonding point of view, the energy parameters of composite model with the 2.5 wt % content was better than those of the composite model with other contents. Therefore, it is considered that MPIA can interact better with the 2.5 wt % content PMSQ composite model. When the PMSQ content is 2.5 wt %, the overall chain movement in the composite model is slower than that of the unmodified model, which can effectively inhibit the diffusion movement of the MPIA chain. In general, the thermal stability of composite molecular models MPIA and PMSQ (2.5 wt %) was better improved. |
format | Online Article Text |
id | pubmed-6267194 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-62671942018-12-17 Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper Zheng, Wei Xie, Jufang Zhang, Jingwen Tang, Chao Zhao, Zhongyong Materials (Basel) Article Polymethylsilsesquioxane (PMSQ) nanoparticles with mass percentages of 0, 2.5, 5.0, 7.2, 9.4 wt %, respectively, were constructed by molecular dynamics methods in this paper. Composite molecular models were established using PMSQ and MPIA (poly-metaphenylene isophthalamide) fiber. The influence of different PMSQ contents on the thermal stability of meta-aramid insulation paper was analyzed from the parameters of mechanical property, interaction energy, and mean square displacement. The results showed that the trend of mechanical properties decreased with the increase of PMSQ content. When the PMSQ content was 2.5 wt %, the mechanical properties of the composited model were the best, which was about 24% higher than that of the unmodified model. From an intermolecular bonding and nonbonding point of view, the energy parameters of composite model with the 2.5 wt % content was better than those of the composite model with other contents. Therefore, it is considered that MPIA can interact better with the 2.5 wt % content PMSQ composite model. When the PMSQ content is 2.5 wt %, the overall chain movement in the composite model is slower than that of the unmodified model, which can effectively inhibit the diffusion movement of the MPIA chain. In general, the thermal stability of composite molecular models MPIA and PMSQ (2.5 wt %) was better improved. MDPI 2018-11-19 /pmc/articles/PMC6267194/ /pubmed/30463181 http://dx.doi.org/10.3390/ma11112317 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Zheng, Wei Xie, Jufang Zhang, Jingwen Tang, Chao Zhao, Zhongyong Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title | Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title_full | Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title_fullStr | Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title_full_unstemmed | Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title_short | Influence of Polymethylsilsesquioxane Content to the Thermal Stability of Meta-Aramid Fiber Insulation Paper |
title_sort | influence of polymethylsilsesquioxane content to the thermal stability of meta-aramid fiber insulation paper |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6267194/ https://www.ncbi.nlm.nih.gov/pubmed/30463181 http://dx.doi.org/10.3390/ma11112317 |
work_keys_str_mv | AT zhengwei influenceofpolymethylsilsesquioxanecontenttothethermalstabilityofmetaaramidfiberinsulationpaper AT xiejufang influenceofpolymethylsilsesquioxanecontenttothethermalstabilityofmetaaramidfiberinsulationpaper AT zhangjingwen influenceofpolymethylsilsesquioxanecontenttothethermalstabilityofmetaaramidfiberinsulationpaper AT tangchao influenceofpolymethylsilsesquioxanecontenttothethermalstabilityofmetaaramidfiberinsulationpaper AT zhaozhongyong influenceofpolymethylsilsesquioxanecontenttothethermalstabilityofmetaaramidfiberinsulationpaper |