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Copper/carbon nanotube composites: research trends and outlook

We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobile...

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Autores principales: Sundaram, Rajyashree M., Sekiguchi, Atsuko, Sekiya, Mizuki, Yamada, Takeo, Hata, Kenji
Formato: Online Artículo Texto
Lenguaje:English
Publicado: The Royal Society 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6281931/
https://www.ncbi.nlm.nih.gov/pubmed/30564393
http://dx.doi.org/10.1098/rsos.180814
_version_ 1783378891894685696
author Sundaram, Rajyashree M.
Sekiguchi, Atsuko
Sekiya, Mizuki
Yamada, Takeo
Hata, Kenji
author_facet Sundaram, Rajyashree M.
Sekiguchi, Atsuko
Sekiya, Mizuki
Yamada, Takeo
Hata, Kenji
author_sort Sundaram, Rajyashree M.
collection PubMed
description We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems.
format Online
Article
Text
id pubmed-6281931
institution National Center for Biotechnology Information
language English
publishDate 2018
publisher The Royal Society
record_format MEDLINE/PubMed
spelling pubmed-62819312018-12-18 Copper/carbon nanotube composites: research trends and outlook Sundaram, Rajyashree M. Sekiguchi, Atsuko Sekiya, Mizuki Yamada, Takeo Hata, Kenji R Soc Open Sci Chemistry We present research progress made in developing copper/carbon nanotube composites (Cu/CNT) to fulfil a growing demand for lighter copper substitutes with superior electrical, thermal and mechanical performances. Lighter alternatives to heavy copper electrical and data wiring are needed in automobiles and aircrafts to enhance fuel efficiencies. In electronics, better interconnects and thermal management components than copper with higher current- and heat-stabilities are required to enable device miniaturization with increased functionality. Our literature survey encouragingly indicates that Cu/CNT performances (electrical, thermal and mechanical) reported so far rival that of Cu, proving the material's viability as a Cu alternative. We identify two grand challenges to be solved for Cu/CNT to replace copper in real-life applications. The first grand challenge is to fabricate Cu/CNT with overall performances exceeding that of copper. To address this challenge, we propose research directions to fabricate Cu/CNT closer to ideal composites theoretically predicted to surpass Cu performances (i.e. those containing uniformly distributed Cu and individually aligned CNTs with beneficial CNT–Cu interactions). The second grand challenge is to industrialize and transfer Cu/CNT from lab bench to real-life use. Toward this, we identify and propose strategies to address market-dependent issues for niche/mainstream applications. The current best Cu/CNT performances already qualify for application in niche electronic device markets as high-end interconnects. However, mainstream Cu/CNT application as copper replacements in conventional electronics and in electrical/data wires are long-term goals, needing inexpensive mass-production by methods aligned with existing industrial practices. Mainstream electronics require cheap CNT template-making and electrodeposition procedures, while data/electrical cables require manufacture protocols based on co-electrodeposition or melt-processing. We note (with examples) that initiatives devoted to Cu/CNT manufacturing for both types of mainstream applications are underway. With sustained research on Cu/CNT and accelerating its real-life application, we expect the successful evolution of highly functional, efficient, and sustainable next-generation electrical and electronics systems. The Royal Society 2018-11-28 /pmc/articles/PMC6281931/ /pubmed/30564393 http://dx.doi.org/10.1098/rsos.180814 Text en © 2018 The Authors. http://creativecommons.org/licenses/by/4.0/ Published by the Royal Society under the terms of the Creative Commons Attribution License http://creativecommons.org/licenses/by/4.0/, which permits unrestricted use, provided the original author and source are credited.
spellingShingle Chemistry
Sundaram, Rajyashree M.
Sekiguchi, Atsuko
Sekiya, Mizuki
Yamada, Takeo
Hata, Kenji
Copper/carbon nanotube composites: research trends and outlook
title Copper/carbon nanotube composites: research trends and outlook
title_full Copper/carbon nanotube composites: research trends and outlook
title_fullStr Copper/carbon nanotube composites: research trends and outlook
title_full_unstemmed Copper/carbon nanotube composites: research trends and outlook
title_short Copper/carbon nanotube composites: research trends and outlook
title_sort copper/carbon nanotube composites: research trends and outlook
topic Chemistry
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6281931/
https://www.ncbi.nlm.nih.gov/pubmed/30564393
http://dx.doi.org/10.1098/rsos.180814
work_keys_str_mv AT sundaramrajyashreem coppercarbonnanotubecompositesresearchtrendsandoutlook
AT sekiguchiatsuko coppercarbonnanotubecompositesresearchtrendsandoutlook
AT sekiyamizuki coppercarbonnanotubecompositesresearchtrendsandoutlook
AT yamadatakeo coppercarbonnanotubecompositesresearchtrendsandoutlook
AT hatakenji coppercarbonnanotubecompositesresearchtrendsandoutlook