Adhesive-free adhesion between heat-assisted plasma-treated fluoropolymers (PTFE, PFA) and plasma-jet-treated polydimethylsiloxane (PDMS) and its application

Conventional low-temperature plasma treatment was reported to minimally improve the adhesion property of polytetrafluoroethylene (PTFE), whereas heat-assisted plasma (HAP) treatment significantly improved the same. An unvulcanized rubber was previously used as an adherent for PTFE. This study aimed to achieve strong adhesive-free adhesion between PTFE and vulcanized polydimethylsiloxane (PDMS) rubber. As-received vulcanized PDMS rubber did not adhere to HAP-treated PTFE, and as-received PTFE did not adhere to vulcanized rubber of plasma-jet (PJ) treated PDMS rubber; however, HAP-treated PTFE strongly adhered to vulcanized PJ-treated PDMS rubber, and both PTFE and PDMS exhibited cohesion failure in the T-peel test. The surface chemical compositions of the PTFE and PDMS sides were determined using X-ray photoelectron spectroscopy. The strong PTFE/PDMS adhesion was explained via hydrogen and covalent bond formation (C–O–Si and/or C(=O)–O–Si) between hydroxyl (C–OH) or carboxyl (C(=O)–OH) groups of the HAP-treated PTFE. This process was also applied to adhesive-free adhesion between a tetrafluoroethylene–perfluoroalkylvinylether copolymer (PFA) and PDMS; subsequently, a translucent PFA/PDMS assembly with strong adhesion was realized together with the PTFE/PDMS assembly. Strong adhesive-free adhesion between fluoropolymers (PTFE, PFA) and vulcanized PDMS rubber without using any adhesives and graft polymer was successfully realized upon plasma treatment of both the fluoropolymer and PDMS sides. Additionally, a PDMS sheet, which was PJ-treated on both sides, was applied to strongly adhere fluoropolymers (PTFE, PFA) to materials such as metal and glass. PJ-treated PDMS was used as an intermediate layer rather than a strong adhesive, achieving PTFE/PDMS/metal and PTFE/PDMS/glass assemblies. The PTFE/PDMS, PDMS/metal, and PDMS/glass adhesion strengths exceeded 2 N/mm.