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Copper-Based Volumetric Filler Dedicated for Ag Paste for Depositing the Front Electrodes by Printing on Solar Si Cells

In this work we present research results on a new paste NPCuXX (where: NP—new paste, CuXX—component, XX—a modifier consisting of Ni and other important elements) based on a copper composite (CuXX) for fabrication of front electrodes in silicon solar cells. The CuXX composite is obtained by chemical...

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Detalles Bibliográficos
Autores principales: Musztyfaga-Staszuk, Małgorzata, Putynkowski, Grzegorz, Socha, Robert, Stodolny, Maciej, Panek, Piotr
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317019/
https://www.ncbi.nlm.nih.gov/pubmed/30544599
http://dx.doi.org/10.3390/ma11122493

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