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Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules
The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al(2)O(3) and AlN fractured only after 10 cycle...
Autores principales: | , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2018
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317225/ https://www.ncbi.nlm.nih.gov/pubmed/30486503 http://dx.doi.org/10.3390/ma11122394 |
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author | Choe, Chanyang Chen, Chuantong Noh, Seungjun Suganuma, Katsuaki |
author_facet | Choe, Chanyang Chen, Chuantong Noh, Seungjun Suganuma, Katsuaki |
author_sort | Choe, Chanyang |
collection | PubMed |
description | The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al(2)O(3) and AlN fractured only after 10 cycles, but with Si(3)N(4) ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si(3)N(4) was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating. |
format | Online Article Text |
id | pubmed-6317225 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2018 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-63172252019-01-08 Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules Choe, Chanyang Chen, Chuantong Noh, Seungjun Suganuma, Katsuaki Materials (Basel) Article The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al(2)O(3) and AlN fractured only after 10 cycles, but with Si(3)N(4) ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si(3)N(4) was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating. MDPI 2018-11-28 /pmc/articles/PMC6317225/ /pubmed/30486503 http://dx.doi.org/10.3390/ma11122394 Text en © 2018 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Choe, Chanyang Chen, Chuantong Noh, Seungjun Suganuma, Katsuaki Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title | Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title_full | Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title_fullStr | Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title_full_unstemmed | Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title_short | Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules |
title_sort | thermal shock performance of dba/amb substrates plated by ni and ni–p layers for high-temperature applications of power device modules |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317225/ https://www.ncbi.nlm.nih.gov/pubmed/30486503 http://dx.doi.org/10.3390/ma11122394 |
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