Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al(2)O(3) and AlN fractured only after 10 cycle...

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Detalles Bibliográficos
Autores principales: Choe, Chanyang, Chen, Chuantong, Noh, Seungjun, Suganuma, Katsuaki
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2018
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317225/
https://www.ncbi.nlm.nih.gov/pubmed/30486503
http://dx.doi.org/10.3390/ma11122394

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6317225/
https://www.ncbi.nlm.nih.gov/pubmed/30486503
http://dx.doi.org/10.3390/ma11122394

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