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Research on a 3D Encapsulation Technique for Capacitive MEMS Sensors Based on Through Silicon Via †

A novel three-dimensional (3D) hermetic packaging technique suitable for capacitive microelectromechanical systems (MEMS) sensors is studied. The composite substrate with through silicon via (TSV) is used as the encapsulation cap fabricated by a glass-in-silicon (GIS) reflow process. In particular,...

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Detalles Bibliográficos
Autores principales:	Zhang, Meng, Yang, Jian, He, Yurong, Yang, Fan, Yang, Fuhua, Han, Guowei, Si, Chaowei, Ning, Jin
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6339255/ https://www.ncbi.nlm.nih.gov/pubmed/30597879 http://dx.doi.org/10.3390/s19010093

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