A 64-pin Nanowire Surface Fastener Like a Ball Grid Array Applied for Room-temperature Electrical Bonding

Surface-mount techniques primarily depend on soldering. However, soldering techniques have encountered some challenges in recent years. These challenges include rare metal recycling, thermal problems, and Pb toxicity. We recently developed a metallic nanowire surface fastener (NSF) to resolve the abovementioned problems. This fastener can be used to connect electronic components on a substrate at room temperature using the van der Waals force between each nanowire. This study demonstrates a 64-pin NSF that behaves like a ball grid array (BGA) for application to actual electronic devices. The adhesion strength and electrical properties of the NSF were investigated by adjusting the nanowire parameters, such as diameter, length, density (number per area), preload, and shape. The shape control of the nanowires greatly contributed to the improvement of the properties. A maximum adhesion strength of 16.4 N/cm(2) was achieved using a bent, hook-like NSF. This strength was 4–5 times the value of the straight NSF. The contact resistivity was 2.98 × 10(−2) Ω∙cm(2). The NSF fabricated through the simple template method showed the room temperature bonding ability and adaptability to a highly ordered electrode like the BGA.