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Research on Wafer-Level MEMS Packaging with Through-Glass Vias

A MEMS fabrication process with through-glass vias (TGVs) by laser drilling was presented, and reliability concerns about MEMS packaging with TGV, likes debris and via metallization, were overcome. The via drilling process on Pyrex 7740 glasses was studied using a picosecond laser with a wavelength...

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Detalles Bibliográficos
Autores principales:	Yang, Fan, Han, Guowei, Yang, Jian, Zhang, Meng, Ning, Jin, Yang, Fuhua, Si, Chaowei
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2018
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6356378/ https://www.ncbi.nlm.nih.gov/pubmed/30597830 http://dx.doi.org/10.3390/mi10010015

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