Applicability of Aerosol Deposition Process for flexible electronic device and determining the Film Formation Mechanism with Cushioning Effects

In this paper, we demonstrated the feasibility of the Aerosol Deposition (AD) method which can be adapted as a future fabrication process for flexible electronic devices. On the basis of this method’s noticeable advantages such as room-temperature processing, suitability for mass production, wide ma...

Descripción completa

Detalles Bibliográficos
Autores principales: Lee, Chuljun, Cho, Myung-Yeon, Kim, Myungjun, Jang, Jiyun, Oh, Yoonsub, Oh, Kihoon, Kim, Seunghyun, Park, Byungwook, Kim, Byungkwan, Koo, Sang-Mo, Oh, Jong-Min, Lee, Daeseok
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6377626/
https://www.ncbi.nlm.nih.gov/pubmed/30770846
http://dx.doi.org/10.1038/s41598-019-38477-y

Ejemplares similares

Ejemplares similares