Implication of thermally conductive nanodiamond-interspersed graphite nanoplatelet hybrids in thermoset composites with superior thermal management capability

Novel hybrid nanofillers composed of nanodiamond-attached graphite nanoplatelets (ND@GNPs) were designed and employed to toughen the epoxy (EP) matrix for fabricating superior thermal conductive and physically robust thermoset nanocomposites for electronics and auto industries. The hybrid nanofiller was covalently bonded by 4,4′-diphenylmethane diisocyanate and it provided distinct enhancement in thermal conductivity and dynamic storage modulus of the EP/ND@GNPs nanocomposites attributing to the unique nanostructure of ND@GNPs that can form strong interfacial interaction with EP matrix, thus restrict the EP molecular motions. The EP/ND@GNPs20 presented a thermal conductivity of 2.48 W · m(−1) · K(−1) and dynamic storage modulus of 5.6 GPa. The presence of ND particles not only can enhance heat transfer efficiency but also improve the interfacial interaction between ND and EP matrix, which can directly affect physical properties of the EP composites.