Effect of encapsulation on electronic transport properties of nanoscale Cu(111) films

The stiff compromise between reliability and conductivity of copper interconnects used in sub-nanometer nodes has brought into focus the choice of encapsulation material. While reliability was the primary driver so far, herein, we investigate how electronic conductivity of Cu(111) thin films is infl...

Descripción completa

Detalles Bibliográficos
Autores principales: Shinde, Prashant P., Adiga, Shashishekar P., Pandian, Shanthi, Mayya, K. Subramanya, Shin, Hyeon-Jin, Park, Seongjun
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401372/
https://www.ncbi.nlm.nih.gov/pubmed/30837632
http://dx.doi.org/10.1038/s41598-019-40193-6

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401372/
https://www.ncbi.nlm.nih.gov/pubmed/30837632
http://dx.doi.org/10.1038/s41598-019-40193-6

Ejemplares similares