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Effect of encapsulation on electronic transport properties of nanoscale Cu(111) films
The stiff compromise between reliability and conductivity of copper interconnects used in sub-nanometer nodes has brought into focus the choice of encapsulation material. While reliability was the primary driver so far, herein, we investigate how electronic conductivity of Cu(111) thin films is infl...
Autores principales: | Shinde, Prashant P., Adiga, Shashishekar P., Pandian, Shanthi, Mayya, K. Subramanya, Shin, Hyeon-Jin, Park, Seongjun |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
Nature Publishing Group UK
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6401372/ https://www.ncbi.nlm.nih.gov/pubmed/30837632 http://dx.doi.org/10.1038/s41598-019-40193-6 |
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