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The Research on Actuation Performance of MEMS Safety-and-Arming Device with Interlock Mechanism

Micro-electromechanical systems (MEMS) safety-and-arming (S&A) device shows great potential in munition miniaturization, and it can be seen as the symbol of the fourth generation of weapons systems. In this paper, the design, fabrication, and actuation performance of a silicon based S&A devi...

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Detalles Bibliográficos
Autores principales: Hu, Tengjiang, Ren, Wei, Zhao, Yulong, Xue, Yan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412507/
https://www.ncbi.nlm.nih.gov/pubmed/30678157
http://dx.doi.org/10.3390/mi10020076
Descripción
Sumario:Micro-electromechanical systems (MEMS) safety-and-arming (S&A) device shows great potential in munition miniaturization, and it can be seen as the symbol of the fourth generation of weapons systems. In this paper, the design, fabrication, and actuation performance of a silicon based S&A device is presented. It is a multilayer stacked device, which is composed of the cover plate, the actuation chip, and the barrel plate. The electro-thermal principle is investigated in MEMS scale. With 11 V driving voltages, the structure of V-shape actuator, pawl, and slider can generate 100 μm and 45 μm displacement, and realize pulling, disengaging, and reengaging to change the device from the safety position into armed position smoothly (550 μm displacement). The rack and interlock mechanism formed by the pawl and slider gives the device the features of linear output displacement, low power consumption, input signal recognition, and sustained displacement. The 20,000 g setback acceleration is applied, and no structure damage can be found after the impact, which indicates the good anti-load ability of the MEMS S&A device. In order to solve the contradiction between the functional structure and the fabrication process, different structures are designed separately on different wafers. Both silicon and SOI wafers are used in the fabrication process, and the S&A device has been minimized into 8.5 mm × 8.5 mm × 0.8 mm successfully.