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Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip
In order to fabricate a digital microfluidic (DMF) chip, which requires a patterned array of electrodes coated with a dielectric film, we explored two simple methods: Ballpoint pen printing to generate the electrodes, and wrapping of a dielectric plastic film to coat the electrodes. For precise and...
Autores principales: | , , , , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412519/ https://www.ncbi.nlm.nih.gov/pubmed/30736440 http://dx.doi.org/10.3390/mi10020109 |
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author | Soum, Veasna Kim, Yunpyo Park, Sooyong Chuong, Mary Ryu, Soo Ryeon Lee, Sang Ho Tanev, Georgi Madsen, Jan Kwon, Oh-Sun Shin, Kwanwoo |
author_facet | Soum, Veasna Kim, Yunpyo Park, Sooyong Chuong, Mary Ryu, Soo Ryeon Lee, Sang Ho Tanev, Georgi Madsen, Jan Kwon, Oh-Sun Shin, Kwanwoo |
author_sort | Soum, Veasna |
collection | PubMed |
description | In order to fabricate a digital microfluidic (DMF) chip, which requires a patterned array of electrodes coated with a dielectric film, we explored two simple methods: Ballpoint pen printing to generate the electrodes, and wrapping of a dielectric plastic film to coat the electrodes. For precise and programmable printing of the patterned electrodes, we used a digital plotter with a ballpoint pen filled with a silver nanoparticle (AgNP) ink. Instead of using conventional material deposition methods, such as chemical vapor deposition, printing, and spin coating, for fabricating the thin dielectric layer, we used a simple method in which we prepared a thin dielectric layer using pre-made linear, low-density polyethylene (LLDPE) plastic (17-μm thick) by simple wrapping. We then sealed it tightly with thin silicone oil layers so that it could be used as a DMF chip. Such a treated dielectric layer showed good electrowetting performance for a sessile drop without contact angle hysteresis under an applied voltage of less than 170 V. By using this straightforward fabrication method, we quickly and affordably fabricated a paper-based DMF chip and demonstrated the digital electrofluidic actuation and manipulation of drops. |
format | Online Article Text |
id | pubmed-6412519 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2019 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-64125192019-04-09 Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip Soum, Veasna Kim, Yunpyo Park, Sooyong Chuong, Mary Ryu, Soo Ryeon Lee, Sang Ho Tanev, Georgi Madsen, Jan Kwon, Oh-Sun Shin, Kwanwoo Micromachines (Basel) Article In order to fabricate a digital microfluidic (DMF) chip, which requires a patterned array of electrodes coated with a dielectric film, we explored two simple methods: Ballpoint pen printing to generate the electrodes, and wrapping of a dielectric plastic film to coat the electrodes. For precise and programmable printing of the patterned electrodes, we used a digital plotter with a ballpoint pen filled with a silver nanoparticle (AgNP) ink. Instead of using conventional material deposition methods, such as chemical vapor deposition, printing, and spin coating, for fabricating the thin dielectric layer, we used a simple method in which we prepared a thin dielectric layer using pre-made linear, low-density polyethylene (LLDPE) plastic (17-μm thick) by simple wrapping. We then sealed it tightly with thin silicone oil layers so that it could be used as a DMF chip. Such a treated dielectric layer showed good electrowetting performance for a sessile drop without contact angle hysteresis under an applied voltage of less than 170 V. By using this straightforward fabrication method, we quickly and affordably fabricated a paper-based DMF chip and demonstrated the digital electrofluidic actuation and manipulation of drops. MDPI 2019-02-07 /pmc/articles/PMC6412519/ /pubmed/30736440 http://dx.doi.org/10.3390/mi10020109 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Soum, Veasna Kim, Yunpyo Park, Sooyong Chuong, Mary Ryu, Soo Ryeon Lee, Sang Ho Tanev, Georgi Madsen, Jan Kwon, Oh-Sun Shin, Kwanwoo Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title | Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title_full | Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title_fullStr | Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title_full_unstemmed | Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title_short | Affordable Fabrication of Conductive Electrodes and Dielectric Films for a Paper-Based Digital Microfluidic Chip |
title_sort | affordable fabrication of conductive electrodes and dielectric films for a paper-based digital microfluidic chip |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412519/ https://www.ncbi.nlm.nih.gov/pubmed/30736440 http://dx.doi.org/10.3390/mi10020109 |
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