In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures

In situ nanoindentation experiments have been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiments in the characterization of nonlinear material properties of 3D integrated microelectronic devices us...

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Detalles Bibliográficos
Autores principales: Wu, Chenglin, Wei, Congjie, Li, Yanxiao
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412547/
https://www.ncbi.nlm.nih.gov/pubmed/30691018
http://dx.doi.org/10.3390/mi10020086

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6412547/
https://www.ncbi.nlm.nih.gov/pubmed/30691018
http://dx.doi.org/10.3390/mi10020086

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